Due to severe weather and safety concerns, the Santa Maria Valley Chamber’s 2025 Business Expo and Job Fair has been postponed to March 25. The event will still take place 11 a.m.-2 p.m. at the Santa Maria Fairpark, 937 S. Thornburg St.
Booth registration will remain open for those interested in showcasing their business.
“Given the severe weather forecasts and the importance of everyone’s safety, we’ve decided to postpone this year’s Business Expo,” said Michael Boyer, president/CEO.
“Ensuring the well-being of our community is our top priority,” he said. “We look forward to welcoming everyone on March 25 when conditions are safer, and we remain dedicated to providing a valuable and productive experience for all involved.”
For any questions or concerns, email yuliana@santamaria.com.
The Santa Maria Chamber has partnered with the Santa Barbara County Workforce Development Board for the expo, which is designed to connect businesses, job seekers and local community members within the Santa Maria Valley community with opportunities for networking and community engagement.
Those attending the free event can talk with some 60 participating business booths, including more than 20 businesses involved in the job fair.
This year’s theme — I Love Santa Maria — highlights the businesses that make the local region special.
Attendees can also fill out a “passport,” in which they will be entered to win a prize if they visit each business booth listed on the passport.
“We are thrilled to host this year’s Business Expo and Job Fair in partnership with The Workforce Development Board,” said Michael Boyer, chamber president/CEO.
“It’s an incredible opportunity to connect with the business community,” he said. “Events like these fuel economic growth, foster innovation and help us build a stronger workforce for the future.
“It’s about making meaningful relationships which lead to real opportunities and partnerships benefiting not only businesses, but the entire community.”
For more about the 2025 Business Expo & Job Fair, click here.



